KEYNOTE SPEAKERS
REGINA DITTMANN
Regina Dittmann
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ReRAM Technology
Regina Dittmann (PGI-7 Research Center Jülich, DE)
date and time TBA
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BERNHARD WICHT
Bernhard Wicht
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Power Management for High Performance Computing
Bernhard Wicht (Leibniz University Hannover, DE)
date and time TBA
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CÉDRIC VIRMONTOIS
Cédric Virmontois
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Image sensors for space applications
Cédric Virmontois (CNES, FR)
date and time TBA
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RAINER MINIXHOFER
Rainer Minixhofer
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System integration considerations in the field of AMS spectrometer applications (e.g. ambient light or biosensors sensors) and/or µDiscretes or more general in electro-optical sensor systems
Rainer Minixhofer (ams OSRAM, DE)
date and time TBA
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ROBERTO EMILIO LUIGI BEZ
Roberto Emilio Luigi Bez
Roberto Bez is Italy Country Manager at Micron and Senior Director of Storage Strategic Technology. His professional background spans device physics, electrical and physical characterization, modeling, and Non‑Volatile Memory (NVM) technology development, with direct contributions to NOR, NAND, and Phase‑Change Memory (PCM) architectures.
He began his career in 1987 at STMicroelectronics, focusing on device physics and NVM technology integration. In 2008, he joined Numonyx as Fellow, where he led the development of PCM and alternative NVM concepts. From 2010 to 2015, he held roles at Micron as Fellow and Process Integration Director, with responsibilities covering NVM architecture and process integration.
From 2015 to 2019, he served as Senior Vice President of R&D at LFoundry, driving technology diversification across optical sensors and power devices.
Roberto has served on the Technical Committees of IEDM, ESSDERC, EPCOS, and the Symposium on VLSI Technology, and was a member of the ESSDERC/ESSCIRC Steering Committee and the Scientific Advisory Board of NamLab.
He has held academic appointments as Contract Professor of Electron Device Physics at the University of Milan and Lecturer in NVM Devices at the University of Padua, Politecnico di Milano, and the University of Udine.
He received a Laurea degree in Physics from the University of Milan in 1985 and is the author or co‑author of more than 140 peer‑reviewed publications and 60 patents in microelectronics.
Memory for a better world
Roberto Emilio Luigi Bez (Micron Semiconductor, IT)
date and time TBA
Memories for a Better World explores how memory and storage technologies have become foundational enablers of artificial intelligence and, by extension, of societal progress. Anchored in Micron’s vision of transforming how the world uses information to enrich life for all, the presentation reframes memory as a strategic catalyst that connects data, intelligence, and real‑world impact. It argues that advances in memory performance, bandwidth, density, and power efficiency directly expand the capabilities of AI across domains such as data centers, healthcare, autonomous systems, smart manufacturing, and climate modeling. The keynote highlights that AI already delivers for the semiconductor industry measurable gains in productivity, yield, and operational safety, while also addressing the growing sustainability challenges of AI infrastructure, including energy use, water consumption, and e‑waste. By showcasing low‑power and high‑bandwidth memory innovations alongside ambitious environmental commitments, the talk positions memory technology as a key lever for enabling AI at scale—responsibly, efficiently, and with meaningful human impact.
IOANNIS KABITOGLOU
Ioannis Kabitoglou
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Quantum Computing and the future of cryptography
Ioannis Kabitoglou (Infineon, DE)
date and time TBA
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CESC GUIM
Cesc Guim
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Emerging computing technologies
Cesc Guim (Openchip, ES)
date and time TBA
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ARYA BEHZAD
Arya Behzad
Arya Behzad is Vice President of R&D Engineering at Broadcom Inc. and an IEEE Fellow. He leads development of connectivity radios, analog front-end and PMU subsystems, as well as broader mixed-signal and analog research, development, and productization across wireless, copper, and fiber communication systems.
He has held engineering leadership and design roles at MicroUnity Systems Engineering, Maxim Integrated, Broadcom, and Apple Inc., contributing to a wide range of wireless and wireline communication systems and ICs. He was named Broadcom Distinguished Engineer and later Broadcom Fellow for his contributions to CMOS RF transceivers and power amplifiers for WLAN.
He has authored numerous technical papers and is the named inventor on over 300 issued U.S. patents. He has taught courses and presented at the IEEE International Solid-State Circuits
Conference (ISSCC) and at universities including UC Berkeley, Caltech, and UCLA, and has served on the technical advisory board of startup companies. He served on the ISSCC Wireless Technical Committee and as Guest Editor and Associate Editor of the IEEE Journal of Solid-State Circuits. His book Wireless LAN Radios: From System Definition to Transistor Design (IEEE Press/Wiley-Interscience) was recognized as an IEEE Communications Society Book of the Month.
He started his studies at Sharif University of Technology. He received the BSEE from Arizona State University as Outstanding Graduate and the MSEE from UC Berkeley, where he worked on the Infopad project under the guidance of the late visionary Prof. Bob Brodersen.
From Air to Copper to Fiber: When Abstraction Boundaries Fail in Modern Communication Systems
Arya Behzad (...)
date and time TBA
For decades, communication-system design has relied on decomposition: defining clean abstraction boundaries between devices, circuits, channels, and algorithms, and optimizing each block independently. This approach has been effective across a wide range of media—from air to copper to fiber—where well-defined interfaces enabled scalable design and implementation. However, in modern communication systems, these abstractions are increasingly breaking down.
Across wireless, wireline, optical-access, and chip-to-chip systems, performance is now governed by tightly coupled interactions among channel impairments, clock generation, power delivery, package and substrate parasitics, calibration, equalization, precoding, error correction, and other system-level design variables. Systems must decide how to budget for imperfection across domains—through improved devices, higher analog fidelity, tighter references, and stronger power delivery, as well as equalization, coding, calibration, and architectural adaptation.
This talk presents a unified view of modern connectivity as a multi-dimensional optimization problem, highlighting how different communication systems distribute complexity and margin across domains, and why traditional “throw-it-over-the-wall” design methodologies are becoming less effective. It further discusses the growing need for multi-disciplinary CAD frameworks capable of capturing cross-domain interactions and enabling system-level co-optimization. As communication systems become inherently coupled, future progress will depend less on isolated advances within domains and more on our ability to understand and design for interactions between them.